PRODUCTS
Micro-Grain Phosphorus Copper
The Products will go through the Microcrystalline process. The structure will be microctystal state
* Smooth surface with good plumpness
* Be able to form a firm and strong anode film
* Enlarge the cycle period of cleaning plated cylinders
* Increasing the utilization of the Copper, It can sace 3% in total.
* Smooth surface with good plumpness
* Be able to form a firm and strong anode film
* Enlarge the cycle period of cleaning plated cylinders
* Increasing the utilization of the Copper, It can sace 3% in total.
Keywords:Micro-grain copper ball, micro-grain, high-level electroplate material, micro grain copper anode
Technical Parameters
Copper(%) | Phosphor(%) | |||
Cu | P | |||
≥99.90% | 0.025%≤P≤ 0.050% | |||
Impurity(%) | ||||
Ag | Fe | Pb | Ni | Zn |
≤0.003% | ≤0.003% | ≤0.003% | ≤0.003% | ≤0.003% |
Main model
Size (inches) | Size (mm) | Model |
φ4/5 | φ20 | CP111M |
φ1 | φ25 | CP112M |
φ11/10 | φ28 | CP113M |
φ3/2 | φ38 | CP116M |
φ9/5 | φ45 | CP118M |
φ2 | φ51 | CP119M |
φ11/5 | φ55 | CP1191M |