PRODUCTS
Micro-Grain Phosphorus Copper
The Products will go through the Microcrystalline process. The structure will be microctystal state
* Smooth surface with good plumpness
* Be able to form a firm and strong anode film
* Enlarge the cycle period of cleaning plated cylinders
* Increasing the utilization of the Copper, It can sace 3% in total.
* Smooth surface with good plumpness
* Be able to form a firm and strong anode film
* Enlarge the cycle period of cleaning plated cylinders
* Increasing the utilization of the Copper, It can sace 3% in total.
Keywords：Micro-grain copper ball, micro-grain, high-level electroplate material, micro grain copper anode
Technical Parameters
| Copper(%) | Phosphor(%) | |||
| Cu | P | |||
| ≥99.90% | 0.025%≤P≤ 0.050% | |||
| Impurity(%) | ||||
| Ag | Fe | Pb | Ni | Zn |
| ≤0.003% | ≤0.003% | ≤0.003% | ≤0.003% | ≤0.003% |
Main model
| Size (inches) | Size (mm) | Model |
| φ4/5 | φ20 | CP111M |
| φ1 | φ25 | CP112M |
| φ11/10 | φ28 | CP113M |
| φ3/2 | φ38 | CP116M |
| φ9/5 | φ45 | CP118M |
| φ2 | φ51 | CP119M |
| φ11/5 | φ55 | CP1191M |
